Dr. Yongzheng Zhan, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
Dr. Zhi-Peng Guo is a Senior Engineer at Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., specializing in the design of 400G/800G Ethernet high-speed interface integrated circuits and the development of Chiplet interconnect protocols. A graduate of Southeast University in 2021, he worked as a postdoctoral fellow at Inspur Group in 2022. Dr. Guo has led and participated in five national and provincial scientific research projects and published over 10 papers in SCI/EI/Peking University Chinese core journals. He holds 45 invention patents, including 10 authorized patents and 1 U.S. patent. Dr. Guo has contributed significantly to innovations in high-speed communication networks, particularly in optimizing link signal integrity and circuit design for 400G Ethernet, PCIe/CXL protocols, and multi-chip interconnect technologies. His leadership in Chiplet integration and advanced packaging research has filled critical gaps in domestic chip standards, advancing the development of next-generation communication technologies.
Publication Profile:
Suitability for the Award:
Dr. Zhan Yongzhengās extensive expertise in high-speed integrated circuit design, innovative Chiplet architectures, and contributions to domestic chip standards make him a highly suitable candidate for the Research for Best Researcher Award. His work spans both theoretical innovation and practical application, addressing critical industry needs while advancing the global standing of domestic technologies.
Academic Background:
Dr. Zhi-Peng Guo graduated from Southeast University in 2021, specializing in high-speed mixed-signal integrated circuit design. He later worked as a postdoctoral fellow at Inspur Group in 2022, advancing his expertise in chiplet interconnect technology and signal integrity analysis. š
Professional Experience & Expertise:
Dr. Guo is a Senior Engineer at Shandong Yunhai Guochuang, where he focuses on designing high-speed interface integrated circuits for 400G/800G Ethernet. He is also involved in the development of Chiplet interconnect protocols and architecture. He has extensive experience in optimizing communication link reliability and signal integrity. ā”
Research & Achievements:
Dr. Guo has contributed significantly to the field of high-speed communication, publishing over 10 papers in prestigious journals and applying for 45 invention patents. He co-authored Chinaās first primary Chiplet standard and won the Excellent Project Award at the 2023 China Shandong Postdoctoral Innovation and Entrepreneurship Finals. š
Contributions to Innovation & R&D:
Dr. Guo has led groundbreaking research on optimizing high-speed Ethernet links and improving signal integrity in 400G/800G Ethernet systems. His work on FEC and equalizer mechanisms for high-reliability transmission has contributed to advancements in communication networks and Chiplet integration. š”š¬
Extension & Knowledge Sharing:
As an expert in the field, Dr. Guo actively participates in scientific committees and reviews for core journals in integrated circuits. His work bridges the gap between cutting-edge technology and practical application in high-speed communication and chip interconnect systems. šš
Publication Top Notes:
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Effect of Different Elastic Systems on Cantilever Beam Energy Harvester
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Equalization Technology and Quantization Analysis for Data-converter Based PAM4 SerDes Link
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Low-Voltage Width-Frequency Ring Piezoelectric Energy Harvester
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Electrical Transport Properties of Few-Layer SnS2 Field-effect Transistors
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Low-power 25Gb/s 16:1 Multiplexer for 400Gb/s Ethernet PHY