Dr. Yongzheng Zhan, Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., China
Dr. Yongzheng Zhan is a Senior Engineer at Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd., specializing in the design of high-speed interface integrated circuits for 400G/800G Ethernet and the development of Chiplet interconnect protocols. A graduate of Southeast University in 2021, Dr. Zhan pursued postdoctoral research at Inspur Group in 2022. He has contributed extensively to the development of high-speed mixed-signal integrated circuit design, link signal integrity analysis, and Chiplet interconnect technology. Dr. Zhan has led and participated in numerous national and provincial research projects, published over 10 research papers, and filed 45 patents, including a US patent and several PCT patents. He played a key role in issuing China’s first primary Chiplet standard and won the Excellent Project Award at the 2023 China Shandong Postdoctoral Innovation and Entrepreneurship Finals. He is an active member of several academic committees, including the Chinese Computer Society and the Chinese Society of Electronics, and serves as a reviewer for core journals in integrated circuits.
Publication Profile:
Suitability for the Award:
Dr. Zhan Yongzheng’s extensive expertise in high-speed integrated circuit design, innovative Chiplet architectures, and contributions to domestic chip standards make him a highly suitable candidate for the Research for Best Researcher Award. His work spans both theoretical innovation and practical application, addressing critical industry needs while advancing the global standing of domestic technologies.
Educational and Career Milestones:
A graduate of Southeast University (2021), Dr. Zhan began his career at Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Co., Ltd. He further honed his expertise as a postdoctoral fellow at Inspur Group in 2022, contributing to innovative research and product development. 🎓🏢
Professional Expertise:
Dr. Yongzheng Zhan specializes in the design of 400G/800G Ethernet high-speed interface integrated circuits and the development of Chiplet interconnect protocols. He focuses on ensuring reliable communication link interactions and advancing cutting-edge technologies like 2.5D/3D advanced packaging. 🔗📡
Research & Achievements:
Dr. Zhan has led 5 national/provincial research projects, published over 10 SCI/EI-indexed papers, and applied for 45 invention patents, including a U.S. patent. He played a pivotal role in establishing China’s first primary Chiplet standard and received the Excellent Project Award in the 2023 China Shandong Postdoctoral Innovation Finals. 📜🏆
Innovations & Contributions:
Dr. Zhan developed a mechanism combining FEC and equalizers to optimize high-speed communication networks and reduce signal crosstalk. His team has achieved groundbreaking advancements in PCIe/CXL protocol design, true random generator technology, and multi-die processor interconnection, bridging gaps in domestic chip standards. 💡🔬
Leadership & Community Impact:
As a member of the Chinese Computer Society and Chinese Society of Electronics, Dr. Zhan has chaired technical committees for ICICM conferences and reviewed prestigious integrated circuit journals. His work continues to shape the future of high-speed interface technology. 🌍📚
Publication Top Notes:
Effect of Different Elastic Systems on Cantilever Beam Energy Harvester
Equalization Technology and Quantization Analysis for Data-converter Based PAM4 SerDes Link
Low-Voltage Width-Frequency Ring Piezoelectric Energy Harvester
Electrical Transport Properties of Few-Layer SnS2 Field-effect Transistors
Low-power 25Gb/s 16:1 Multiplexer for 400Gb/s Ethernet PHY